Procédé de fabrication de composant électronique

Herstellungsverfahren für elektronikkomponenten

Electronic component manufacturing method

Abstract

There is provided a method of producing an electronic component capable of preventing electrostatic destruction on a circuit or the like formed on the electronic component by eliminating the electrification charge generated on a pressure-sensitive adhesive sheet efficiently in a short period of time upon producing the electronic component using the pressure-sensitive adhesive sheet. The present invention is a method of producing an electronic component using a pressure-sensitive adhesive sheet in which at least a pressure-sensitive adhesive layer and a separator are sequentially stacked on a base material, the pressure-sensitive adhesive sheet having 900 seconds or less of a half-value period of the electrification charge generated on a surface of said pressure-sensitive adhesive layer by the charge decay measuring method based on JIS L1094, at least comprising: a step of peeling said separator off from said pressure-sensitive adhesive layer; a step of eliminating the electrification charge on the surface of said pressure-sensitive adhesive layer; and a step of bonding an electronic component onto said pressure-sensitive adhesive layer after charge elimination.

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    See references of WO 2012018083A1

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